Singapore, April 22, 2024 – AEM, a leading global provider of test and handling solutions, announces the expanded adoption of its industry-leading active thermal control solutions for upcoming AI devices with high power thermal demands. This significant milestone comes as a major fabless provider of high-performance compute (HPC) and artificial intelligence (AI) semiconductor chips selects AEM’s thermal engine as the Plan-of-Record for their advanced System Level Test (SLT) insertions.
The high parallel thermal engine, tailored for high-volume manufacturing (HVM), is strategically designed to cater to the evolving test needs of the customer’s new device roadmap. Initial deliveries are scheduled to commence in FY 2024, with subsequent deliveries anticipated in the following years.
One notable feature of AEM’s thermal engine is its exclusion of traditional CFC (Chlorofluorocarbon) cooling fluids. CFCs are known to contribute significantly to ozone depletion and climate change, leading to an international consensus to phase out their production and use.
AEM’s selection as the preferred thermal control solution provider underscores the company’s commitment to delivering highly differentiated, cost-effective solutions aligned with the exacting requirements of its customers. This win reinforces AEM’s stature as an industry leader in thermal performance for packaged test.
“We are thrilled to have our advanced thermal control solutions selected as the Plan-of-Record by a major player in the semiconductor industry,” said Chandran Nair, the Chief Executive Officer of AEM. “This recognition underscores our relentless commitment to innovation and customer-centricity. We look forward to partnering with our customers to address their evolving test needs and contribute to the success of their new device roadmap.”
