Leader in high-performance processor testing for the AI era
As leaders in thermal, high-power, and highly parallel test solutions, we partner with our customers to unlock the potential of the AI revolution.
AI chips set a new paradigm in advanced packaging, high-power thermal requirements, and demanding test coverage.
Our common active thermal collaterals are integrated into various test insertion solutions, ranging from engineering lab to high-volume manufacturing, to enable rapid time-to-market and yield improvements.
High-power, high-throughput automated burn-in capabilities integrated with high-parallel test platform.
Test Cell Concept enabling Burn-in, Final Test Lite, and System Level Test on a single platform.
Our custom, application-specific ATE Test Solutions offer a full test suite with Test Systems hardware, software, and support services.
Network infrastructure solutions certify Ethernet and Fiber Optic cabling and validation testing across various Smart Building technologies.
Talk to us to find out how we can meet your test and innovation requirements.
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Test at any scale, at any stage of the innovation process. Explore our portfolio of application-specific solutions
Offers a full test solution with Test Systems hardware, software & support.
Offers innovative cabling and component test solutions designed for Laboratory, Manufacturing, and Field Use applications.
