Testing Innovation
Leader in high-performance processor testing for the AI era
As leaders in thermal, high-power, and highly parallel test solutions, we partner with our customers to unlock the potential of the AI revolution.
AI chips set a new paradigm in advanced packaging, high-power thermal requirements, and demanding test coverage.
Our common active thermal collaterals are integrated into various test insertion solutions, ranging from engineering lab to high-volume manufacturing, to enable rapid time-to-market and yield improvements.
Test Cell Solutions
System Level Test Solutions
Test Cell Concept enabling Burn-in, Final Test Lite, and System Level Test on a single platform.
Instrumentation
ATE Solutions
Our custom, application-specific ATE Test Solutions offer a full test suite with Test Systems hardware, software, and support services.
Precision Cable Test
Network infrastructure solutions certify Ethernet and Fiber Optic cabling and validation testing across various Smart Building technologies.
Customized Solutions for the Needs of Advanced Industries
- Material handling for devices modules, panels, and wafers
- Factory Automation
- Device-Level Active Thermal Control
- Chamber Level Thermal Control
- System Level Thermal Control
- AOI-Based Solutions
- Inspection and Measurement
- High Speed Link Performance Testing
- Application-Specific Solutions for Wafer Level Test of MEMS and Semiconductor Devices
- In-House Capability
- Third Party Integration Custom Development
- Precise electro-mechanical Interfacing for devices, wafers, and modules
- Industry Standard Tools
- Factory/Handler Automation
- Test Software
- Application Layer Software
- Third Party Solutions
Customization
is in our DNA
Talk to us to find out how we can meet your test and innovation requirements.
